Everyone knows that the Blue Wood Car Standard Crystal Oscillator is the heart of digital circuits, and experts have a certain understanding of Car Standard Crystal Oscillators. Do you know what factors can cause crystal oscillator damage? Let's take a look at some conditional factors related to crystal oscillator damage.

1. There is a phenomenon of falling during the production process, which means that only the crystal oscillator causes excessive external impact force, because the crystal oscillator chip is relatively thin and needs to be handled gently.

2. When soldering the crystal oscillator to the circuit board, the welding temperature may be too high, resulting in poor crystal oscillator performance.

3. During the welding process, virtual welding, also known as false welding, occurs, causing the crystal oscillator to not be energized.

4. After the crystal oscillator is soldered, the solder is connected to the circuit, causing a short circuit phenomenon.

5. In the leak detection process, under the pressure of alcohol, quartz crystal resonators are prone to shell collision, that is, the chip and the shell are prone to collision during vibration, resulting in the crystal being prone to vibration, non vibration or stopping.

6. When sealing, it is required to vacuum and fill nitrogen inside the crystal. If poor sealing occurs, that is, the sealing of the crystal is not good, under the condition of alcohol pressure, it manifests as air leakage, known as double leakage, which can also cause vibration stoppage.

7. Due to the thin thickness of the chip itself, excessive excitation power can cause damage to the internal quartz chip, leading to vibration stoppage.

8. Functional loads can reduce the Q value (i.e. quality factor), leading to a decrease in the stability of the crystal. It is easily affected by peripheral active components and is in an unstable state, resulting in oscillations and non oscillations.

9. Due to the tendency of crystals to generate mechanical and thermal stresses during foot cutting and soldering, high soldering temperatures and prolonged exposure time can both affect the crystals, leading to critical states and even intermittent or even stopping vibrations.

10. When soldering, when the tin wire seeps through the small holes on the circuit board, causing the pins to be connected to the casing, or when the single leakage occurs between the tin points of the pins on the base and the casing during the manufacturing process, it can cause a short circuit and cause vibration stoppage.

11. When the crystal frequency undergoes frequency drift and exceeds the deviation range of the quartz crystal oscillator too much, the center frequency of the crystal cannot be captured, resulting in the chip not starting to vibrate.